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The influence of deformation at cryogenic or room temperature followed by annealing on the structure and properties of copper and its Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys

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Заглавие The influence of deformation at cryogenic or room temperature followed by annealing on the structure and properties of copper and its Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys
 
Автор Novikova, O. S.
Kostina, A. E.
Salamatov, Y. A.
Zgibnev, D. A.
Volkov, A. Y.
 
Тематика ANOMALY OF STRENGTH PROPERTIES
COPPER ALLOY WITH SMALL ADDITIVES OF PALLADIUM AND SILVER
COPPER ALLOYING WITH PALLADIUM AND SILVER
CRYODEFORMATION
CU
CU–3PD–3AG
CU–PD
RESISTOMETRY
 
Описание Due to low electrical resistivity, the Cu–Pd and Cu–Pd–Ag system alloys can be used as corrosion-resistant conductors of weak electrical signals. The paper deals with a comparison of the structure and physical-mechanical properties of Cu, Cu–3Pd and Cu–3Pd–3Ag (at. %) alloys after deformation at room or cryogenic temperature followed by annealing. The authors studied specimens in different initial states: quenched, deformed at room and cryogenic temperatures. To study the processes of structure rearrangement and the evolution of properties, annealing was carried out in the temperature range from 100 to 450 °C, followed by cooling in water. The duration of heat treatments was 1 h. The dependences of the yield strength and elongation to failure on the annealing temperature showed that cryodeformation significantly increases the thermal stability of the structure of both pure copper and the Cu–3Pd–3Ag ternary alloy. According to the temperature dependence of specific electrical resistivity of the deformed Cu–3Pd–3Ag alloy during heating at a rate of 120 deg./h, it was found that the decrease in electrical resistance caused by recrystallization begins at above 300 °C. The dependences of specific electrical resistivity on true strain showed that the structure rearrangement mechanisms during deformation are different for pure copper and the Cu–3Pd–3Ag alloy. The results of mathematical processing of the peaks in the diffraction patterns established that two phases appear in the Cu–3Pd–3Ag alloy after cryodeformation and annealing, one of which is silver-enriched, and the other is depleted. The study showed that during annealing of the deformed (especially after cryodeformation) Cu–3Pd–3Ag alloy, an anomalous increase in strength properties is observed. It was identified that alloying copper with palladium and silver leads to an increase in the recrystallization temperature. Thus, copper alloys with small palladium and silver additives are obviously attractive for practical applications, since they have improved strength properties, satisfactory electrical conductivity, and a higher recrystallization temperature compared to pure copper. © 2023 Russian Association of Allergologists and Clinical Immunologists, St. Petersburg Regional Branch (SPb RAACI). All rights reserved.
Acknowledgements: The work was carried out within the state assignment, on the topic “Pressure”, state registration No. 122021000032-5. X-ray structure analysis was performed using the equipment of the “Composition of Compounds” Shared Access Center of the IHTE UB RAS.
 
Дата 2024-04-05T16:30:45Z
2024-04-05T16:30:45Z
2023
 
Тип Article
Journal article (info:eu-repo/semantics/article)
|info:eu-repo/semantics/publishedVersion
 
Идентификатор Новикова, О, Костина, А, Саламатов, Ю, Згибнев, ДА & Волков, АЮ 2023, 'ВЛИЯНИЕ ДЕФОРМАЦИИ ПРИ КРИОГЕННОЙ ИЛИ КОМНАТНОЙ ТЕМПЕРАТУРЕ С ПОСЛЕДУЮЩИМ ОТЖИГОМ НА СТРУКТУРУ И СВОЙСТВА МЕДИ И ЕЕ СПЛАВОВ CU-3PD И CU-3PD-3AG (AT. %)', Frontier Materials & Technologies, № 2, стр. 77-87. https://doi.org/10.18323/2782-4039-2023-2-64-6
Новикова, О., Костина, А., Саламатов, Ю., Згибнев, Д. А., & Волков, А. Ю. (2023). ВЛИЯНИЕ ДЕФОРМАЦИИ ПРИ КРИОГЕННОЙ ИЛИ КОМНАТНОЙ ТЕМПЕРАТУРЕ С ПОСЛЕДУЮЩИМ ОТЖИГОМ НА СТРУКТУРУ И СВОЙСТВА МЕДИ И ЕЕ СПЛАВОВ CU-3PD И CU-3PD-3AG (AT. %). Frontier Materials & Technologies, (2), 77-87. https://doi.org/10.18323/2782-4039-2023-2-64-6
2782-4039
Final
All Open Access, Gold
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85167418780&doi=10.18323%2f2782-4039-2023-2-64-6&partnerID=40&md5=49957fafa40cbb26f4fa5f1f71f9cbf6
https://www.vektornaukitech.ru/jour/article/download/842/785
http://elar.urfu.ru/handle/10995/130705
54134479
10.18323/2782-4039-2023-2-64-6
85167418780
 
Язык ru
 
Права Open access (info:eu-repo/semantics/openAccess)
cc-by
https://creativecommons.org/licenses/by/4.0/
 
Формат application/pdf
 
Издатель Togliatti State University
 
Источник Frontier materials & technologies
Frontier Materials and Technologies