Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases
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Заглавие |
Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases
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Автор |
Shishkin, R. A.
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Описание |
Over the last decade, the rapid development of high-end electronics has led to the need for efficient dissipation of high heat flux densities. Consequently, more and more stringent requirements to the properties of thermal interface materials (TIM) are formed. Additions of submicron spherical diamond particles and silicon whiskers were considered to increase the thermal conductivity of polymer composites. Despite the composite material structure densification, the addition of diamond monotonically decreases the thermal conductivity. Silicon whiskers vice verse slightly rises it. The application of ultrasonic treatment (UST) with a frequency of 22±1.65 kHz and power 260 W for 15 minutes allows increasing the thermal conductivity of composite materials containing silicon whiskers by 5-10%. © 2022 Author(s).
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Дата |
2024-04-22T15:52:42Z
2024-04-22T15:52:42Z 2022 |
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Тип |
Conference paper
Conference object (info:eu-repo/semantics/conferenceObject) Published version (info:eu-repo/semantics/publishedVersion) |
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Идентификатор |
Shishkin, RA 2022, Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases. в AA Gibadullin, SS Sadullozoda & DE Morkovkin (ред.), International Scientific and Practical Symposium "Materials Science and Technology", MST 2021., 020022, AIP Conference Proceedings, Том. 2632, American Institute of Physics Inc., 2021 International Scientific and Practical Symposium on Materials Science and Technology, MST 2021, Dushanbe, Таджикистан, 19/10/2021. https://doi.org/10.1063/5.0098840
Shishkin, R. A. (2022). Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases. в A. A. Gibadullin, S. S. Sadullozoda, & D. E. Morkovkin (Ред.), International Scientific and Practical Symposium "Materials Science and Technology", MST 2021 [020022] (AIP Conference Proceedings; Том 2632). American Institute of Physics Inc.. https://doi.org/10.1063/5.0098840 978-073544367-9 0094-243X Final All Open Access; Bronze Open Access https://aip.scitation.org/doi/pdf/10.1063/5.0098840 https://aip.scitation.org/doi/pdf/10.1063/5.0098840 http://elar.urfu.ru/handle/10995/132336 10.1063/5.0098840 85140303742 |
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Язык |
en
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Права |
Open access (info:eu-repo/semantics/openAccess)
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Формат |
application/pdf
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Издатель |
American Institute of Physics Inc.
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Источник |
AIP Conference Proceedings
AIP Conference Proceedings |
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