The dynamic sublayers for improving the adhesion of CVD diamond films on copper
Электронный архив ТПУ
Информация об архиве | Просмотр оригинала| Поле | Значение | |
| Заглавие |
The dynamic sublayers for improving the adhesion of CVD diamond films on copper
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| Автор |
Gaydaychuk, Alexander Valerievich
Linnik, Stepan Andreevich Okhotnikov, Vitaly Vladimirovich |
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| Тематика |
адгезия
алмазные пленки поликристаллические пленки медные подложки физическое осаждение паровые фазы промежуточные слои |
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| Описание |
Polycrystalline diamond films were fabricated on copper substrates by a multi-step process comprised of physical vapor deposition of Al-based composite interlayer on Cu substrate and depositing continuous diamond film on composite interlayer by plasma assisted chemical vapor deposition (PACVD). The interface characteristics and adhesion strength were investigated by Auger electron spectroscopy, Raman analysis, calotest and indentation test. The results show that the continuous film without cracks is successfully obtained. The improved adhesion between diamond film and substrate results from the low residual stress in the film due to their compensation by Al interlayer in the sample cooling process.
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| Дата |
2017-06-08T04:19:08Z
2017-06-08T04:19:08Z 2017 |
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| Тип |
Conference Paper
Published version (info:eu-repo/semantics/publishedVersion) Conference paper (info:eu-repo/semantics/conferencePaper) |
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| Идентификатор |
Gaydaychuk A. V. The dynamic sublayers for improving the adhesion of CVD diamond films on copper / A. V. Gaydaychuk, S. A. Linnik, V. V. Okhotnikov // Journal of Physics: Conference Series. — 2017. — Vol. 830 : Energy Fluxes and Radiation Effects 2016 : 5th International Congress, 2–7 October 2016, Tomsk, Russian Federation : [materials]. — [012102, 5 p.].
http://earchive.tpu.ru/handle/11683/39488 10.1088/1742-6596/830/1/012102 |
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| Язык |
en
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| Связанные ресурсы |
Journal of Physics: Conference Series. Vol. 830 : Energy Fluxes and Radiation Effects 2016. — Bristol, 2017.
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| Права |
Open access (info:eu-repo/semantics/openAccess)
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| Издатель |
IOP Publishing
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